System and methods for producing a color filter

ABSTRACT

The invention provides a color filter which includes a light shielding region having sufficient light shielding performance, and a transmitting region having no color mixing, and which has high contrast without pixel defect and irregularity in color tone. A color filter of the present invention can include a pixel region and a spotting precision test region. The pixel region includes a light shielding region and a transmitting region partitioned by the light shielding region. The light shielding region includes a first light shielding layer. The transmitting region includes a color element. The spotting precision test region is positioned apart from the pixel region and includes a second light shielding layer and a spotting precision test layer provided to cover at least the second light shielding layer. The spotting precision test layer region includes an evaluation region partitioned by the second light shielding layer.

This is a Division of application Ser. No. 10/175,070 filed Jun. 20,2002, now U.S. Pat. No. 6,830,855. The entire disclosure of the priorapplication is hereby incorporated by reference herein in its entirety.

BACKGROUND OF THE INVENTION

1. Field of Invention

The present invention relates to a color filter and a method ofproducing the same, a droplet spotting precision test substrate for acolor filter and a method of producing the substrate, a light emissionsubstrate and a method of producing the same, a droplet pottingprecision test substrate for a light emission substrate and a method ofproducing the substrate, an electrooptic device and electronic apparatuseach including the color filter or the light emission substrate, and afilm deposition method and apparatus.

2. Description of Related Art

In recent years, demands for liquid crystal displays have increased withprogress in personal computers, particularly portable personalcomputers. Accordingly, there is an urgent need to establish a highquality display at a reasonable cost. From the viewpoint ofenvironmental protection, it has recently been required to convert to animproved process capable of decreasing environmental loading.

Currently, as a conventional method of producing a color filter, thefollowing method is known. In this method, a chromium thin film as alight shielding material is first patterned by photolithography andetching to form a black matrix. Then, apertures of the black matrix arecoated with photosensitive resins of red, green and blue by spin coatingfor each color, and then patterned by photolithography. As a result, acolor matrix can be formed, in which colored layers (dots) of red, greenand blue are arranged adjacent to each other. In the production method,the photolithography step must be performed for each of the respectivecolors of read, green and blue, and the photosensitive material is lostdue to removal of an unnecessary portion during patterning of eachcolor, resulting in a color filter having high environmental loading andhigh cost.

SUMMARY OF THE INVENTION

As a method for resolving the problem of the production method, forexample, Japanese Unexamined Patent Application Publication No. 59-75205proposes a method using an ink jet process. In this method, a materialhaving low wettability with ink is deposited in a matrix to form apartition for dividing a colored layer formation region, and then theregions within the partition are coated with a non-photosensitive colormaterial by the ink jet process to form the colored layers. Thisproduction method can decrease complexity of the photolithographyprocess, and further decrease the loss of the color material. Therefore,there have been many proposals of color filter producing methods eachincluding the step of coating the non-photosensitive color material by adroplet discharge method such as the ink jet process or the like.

An object of the present invention is to provide a color filter and alight emission substrate each of which is formed by discharging adroplet material. The invention can include a light shielding regionwith sufficient light shielding performance and a transmitting regionwithout color mixing, and exhibits high contrast without a pixel defectand irregularity in color tone.

Another object of the present invention is to provide a method ofproducing a color filter and a method of producing a light emissionsubstrate, which are capable of precisely applying a color material to apredetermined region by discharging a droplet material.

A further object of the present invention is to provide a dropletmaterial spotting precision test substrate for a color filter and amethod of producing the substrate, and a droplet material spottingprecision test substrate for a light emission substrate and a method ofproducing the substrate, both of which are used for precisely applying acoloring material to a predetermined region by discharging a dropletmaterial.

A still further object of the present invention is to provide a methodof measuring droplet material spotting precision by using the colorfilter, the light emission substrate or the droplet material spottingprecision test substrate for the color filter or the light emissionsubstrate.

A further object of the present invention is to provide an electroopticdevice and an electronic apparatus each including the color filer or thelight emission substrate.

A further object of the present invention is to provide a filmdeposition method and a film deposition apparatus each using a dropletmaterial.

The color filter and method of measuring spotting precision of a dropletmaterial of the present invention can include a pixel region having alight shielding region and a transmitting region partitioned by thelight shielding region, and a spotting precision test region positionedapart from the pixel region. The invention can also include a firstlight shielding layer provided in the light shielding region, a colorelement provided in the transmitting region, a second light shieldinglayer provided in the spotting precision test region, and a spottingprecision test layer provided in the spotting precision test region soas to cover at least the second light shielding layer. An evaluationregion partitioned by the second light shielding layer can be providedin the spotting precision test region.

In the color filter of the present invention, the pixel region can meana region including pixels used for the color filter. The spottingprecision test region can mean a region of the color filter, in whichthe pixels are not formed, or a region including pixels not used for aspixels for the color filter. The evaluation region can mean a regionserving as an evaluation object of spotting precision of a dropletmaterial in a spotting precision test of the droplet material.

The color filter of the present invention can include the evaluationregion provided in the spotting precision test region, and thus thespotting precision test of the droplet material can be performed on thespotting precision test layer, thereby permitting the droplet materialto be precisely applied to a predetermined region in the pixel region.Therefore, the color filter of the present invention has sufficientlight shielding performance in the light shielding region, and causes nocolor mixing in the transmitting region, thereby causing neither pixeldefect nor irregularity in color tone, and high contrast. This colorfilter is described in detail in “Description of Embodiments” below.

The invention can also include a color filter including a pixel regionhaving a light shielding region and a transmitting region surrounded bythe light shielding region, a color element formed in the transmittingregion by discharging a droplet material, and a peripheral regionarranged adjacent to the pixel region and having a light shieldingregion. The invention can further include an evaluation region includedin the peripheral region and surrounded by the light shielding region ofthe peripheral region to have a shape corresponding to the shape of thetransmitting region.

The color filter of the present invention includes the evaluationregion, and thus the spotting precision test of the droplet material canbe performed on the evaluation region, thereby permitting the dropletmaterial to be precisely applied to a predetermined region in the pixelregion. Therefore, the color filter of the present invention hassufficient light shielding performance in the light shielding region,and causes no color mixing in the transmitting region, thereby causingneither pixel defect nor irregularity in color tone, and high contrast.

The present invention can include a color filter having a pixel regionhaving a light shielding region and a transmitting region surrounded bythe light shielding region, a color element formed in the transmittingregion by discharging a droplet material, a peripheral region arrangedadjacent to the pixel region and having a light shielding region, anevaluation region included in the peripheral region and surrounded bythe light shielding region of the peripheral region, and a layer havingthe property of repelling the droplet material and provided in theperipheral region so as to cover the region surrounded by the evaluationregion.

The color filter of the present invention includes the layer provided inthe peripheral region to cover the evaluation region and having theproperty of repelling the droplet material, and thus the spottingprecision test of the droplet material can be performed on the layer,thereby permitting the droplet material to be precisely applied to apredetermined region in the pixel region. Therefore, the color filter ofthe present invention has sufficient light shielding performance in thelight shielding region, and causes no color mixing in the transmittingregion, thereby causing neither pixel defect nor irregularity in colortone, and high contrast.

The present invention can also include a color filter having a pixelregion having a light shielding region and a plurality of transmittingregions surrounded by the light shielding region, a color element formedin each of the transmitting regions by discharging a droplet material, aperipheral region arranged adjacent to the pixel region and having alight shielding region, and an evaluation region included in theperipheral region and surrounded by the light shielding region of theperipheral region. The plurality of transmitting regions and theevaluation region are arrayed.

The color filter of the present invention can include the plurality oftransmitting regions and the evaluation region, which are arrayed, andthus the spotting precision test of the droplet material can beperformed on the evaluation region, thereby permitting the dropletmaterial to be precisely applied to a predetermined region in the pixelregion. Therefore, the color filter of the present invention hassufficient light shielding performance in the light shielding region,and causes no color mixing in the transmitting region, thereby causingneither pixel defect nor irregularity in color tone, and high contrast.

By using the color filter of the present invention, the spottingprecision of the droplet material can be measured in the spottingprecision test region by forming a convex layer by spotting the dropletmaterial on the spotting precision test layer. In this measurementmethod, the convex layer is formed on the spotting precision test layerprovided in the spotting precision test region of the color filter ofthe present invention.

The color filter of the present invention may have any of the followingforms. For example, the light shielding region constituting the pixelregion can further include a bank layer which can be provided on thefirst light shielding layer provided in the pixel region. In thisconstruction, the bank layer is provided on the first light shieldinglayer provided in the pixel region, and thus the light shieldingfunction and the function to divide the color element can beindependently provided, thereby securely exhibiting both functions. As aresult, the color filter of the present invention produces less pixeldefect due to insufficient light fielding performance and color mixing.Furthermore, by dividing these functions, materials suitable for formingthe first light shielding layer and the bank layer provided in the pixelregion can be selected from a wide range, causing an advantage from theviewpoint of production cost. Particularly, when the first lightshielding layer can include a metal layer, uniform and sufficient lightshielding performance can be obtained by a thin layer.

Additionally, the second light shielding layer provided in the spottingprecision test region may have the same pattern as the first lightshielding layer provided in the pixel region. In this construction, whenthe spotting precision test of the droplet material is performed for thespotting precision test layer of the color filter of the presentinvention, the spotting precision of the droplet material can beevaluated on the assumption that the droplet material is spotted in aregion of the pixel region in which the color element is formed.

Further, a vernier layer can be provided in the spotting precision testregion. In this construction, when the spotting precision test of thedroplet material is performed for the spotting precision test layer, adeviation of a spot position of the droplet material can be determinedby a relative position between the droplet material layer formed on thespotting precision test layer and the vernier layer. In this case, thevernier layer can be provided at a predetermined position in theevaluation region. Also, in this case, the vernier layer can also beformed by using the same material as the second light shielding layer.

A droplet material spotting precision test substrate for a color filterof the present invention can include a spotting precision test regionincluding a light shielding layer and a spotting precision test layerformed to at least cover the light shielding layer, wherein anevaluation region partitioned by the light shielding layer is providedin the spotting precision test region.

In the present invention, the spotting precision test of the dropletmaterial can be performed for the spotting precision test substrate forthe color filter of the present invention before the color filter isproduced, and thus the color element of the color filter to be actuallyproduced can be formed after the spotting precision of the dropletmaterial is sufficiently confirmed and then improved. Therefore, inproducing the color filter, the droplet material can be preciselyapplied to the predetermined region to produce the color filterexhibiting sufficient light shielding performance in the light shieldingregion and no color mixing in the transmitting region, and high contrastwithout a pixel defect and irregularity of color tone.

By using the droplet material spotting precision test substrate for thecolor filter of the present invention, the spotting precision of thedroplet material is measured in the spotting precision test region byforming a convex layer by spotting the droplet material on the spottingprecision test layer. In this measurement method, the convex layer isformed on the spotting precision test layer in the droplet materialspotting precision test substrate for the color filter of the presentinvention.

Furthermore, a vernier layer can be provided in the droplet materialspotting precision test substrate for the color filter of the presentinvention. In this case, the vernier layer can be provided at apredetermined position in the evaluation region. Additionally, in thiscase, the vernier layer can also be formed by using the same material asthe light shielding layer. This construction has the same function andeffect as the color filter of the present invention.

The present invention includes a method of producing a color filter ofthe present invention including the steps of forming a first lightshielding layer having a predetermined matrix pattern in a pixel regionto provide a light shielding region including the first light shieldinglayer, forming a second light shielding layer having a predeterminedpattern in a spotting precision test region positioned apart from thepixel region to form an evaluation region partitioned by the secondlight shielding layer, the step of forming a spotting precision testlayer to cover at least the second light shielding layer in the spottingprecision test region, and the step of forming a color element in acolor element formation region in the pixel region to form atransmitting region partitioned by the light shielding region.

In the specification, the color element formation region can mean aregion of the pixel region in which the color element is formed.Specifically, the color element formation region can mean a region ofthe pixel region, which is partitioned by the light shielding region inthe pixel region. The light shielding region mainly includes the firstlight shielding layer, and a bank layer (described below) according todemand.

The method of producing the color filter of the present invention canproduce the color filter having neither pixel defect nor irregularity incolor tone, and high contrast by a simple process.

The method of producing the color filter of the present invention mayuse any of the following modes. For example, the step of forming thespotting precision test layer in the spotting precision test region andforming a bank layer on the first light shielding layer in the pixelregion. In this production method, a coloring material of each of thecolors, for example, red, green and blue, can be applied to the colorelement formation region without causing color mixing, thereby obtainingthe color filter having no defect such as irregularity in color tone,and high contrast.

Additionally, the method may further include the step of spotting thedroplet material on the spotting precision test layer to form a convexlayer in the spotting precision test region. In this production method,the color element actually used as a pixel can be formed by spotting thedroplet material in the color element formation region in the pixelregion after the spotting precision of the droplet material is evaluatedby forming the convex droplet material layer on the spotting precisiontest layer in the spotting precision test region. Therefore, the colorelement can be precisely applied to the predetermined region, and thusthe color filter exhibiting sufficient light shielding performance inthe pixel region and no color mixing in the light shielding region, andhaving neither pixel defect nor irregularity in color tone, and highcontrast can be produced by a simple process.

Further, each of the first and second light shielding layers can beformed by forming a metal layer on a substrate, and then patterning themetal layer by photolithography and etching. In this construction, byusing a metal layer for each of the first and second light shieldinglayers, sufficient and uniform light shielding performance can be obtainby a thin layer. The metal layer can be formed by a vapor depositionmethod, a sputtering method, a chemical vapor deposition method, or thelike.

The step of forming the first light shielding layer can include the stepof forming the second light shielding layer in the spotting precisiontest region, and forming a vernier layer at a predetermined position inthe evaluation region.

The step of forming the spotting precision layer can include the step offorming a photosensitive region layer on the first light shielding layerin the pixel region, and then pattering the photosensitive resin layerby photolithography to form the bank layer. The bank layer is notrequired to have light shielding performance, and thus need not beblack. Thus, the bank layer can be selected from a wide range of agenerally available photosensitive resin compositions.

The step of forming a color element can include the step of applying thedroplet material to the color element formation region by using adroplet material discharge head to from the color element. This methodcan form the color filter of the present invention by a small number ofsimple steps. Namely, the color element is formed by applying thedroplet material from the droplet material discharge head, and thus thestep of patterning by photolithography can be removed to simplify theprocess. Since the droplet material is deposited to the color elementformation region by using the droplet material discharge head, thedroplet material can be applied only to a necessary region. Unlikepatterning by photolithography, the coloring material is not lost byremoving an unnecessary potion, and the cost of the color filter can bedecreased. In the present invention, the droplet material can be appliedas droplets of 6 to 30 pico-liters. By controlling the number of suchdroplets, a desired amount of droplet material can be precisely appliedto a fine region of, for example, a 40- to 100-μm square.

The present invention can include a method of producing a dropletmaterial spotting precision test substrate for a color filter of thepresent invention including the steps of forming a light shielding layerhaving a predetermined matrix pattern to form an evaluation regionpartitioned by the light shielding layer, and forming a spottingprecision test layer to cover at least the light shielding layer to forma spotting precision test region.

The method of producing the droplet material spotting precision testsubstrate for the color filter of the present invention hassubstantially the same function and effect as the method of producingthe color filter of the present invention.

The method of producing the droplet material spotting precision testsubstrate for the color filter of the present invention may have any ofthe following forms. For example, the method may further include thestep of spotting the droplet material on the spotting precision testlayer in the spotting precision test region to form a convex layer.

In the step of forming the light shielding layer, the light shieldinglayer can be formed by forming a metal layer on a substrate, and thenpatterning the metal layer by photolithography and etching. Also thestep can include the step of forming the light shielding layer andforming a vernier layer at a predetermined position in the evaluationregion.

The production method described above has substantially the samefunction and effect as the method of producing the color filter of thepresent invention. When the method described above is performed beforethe color filter is actually produced, the color element of the colorfilter to be actually produced can be formed after the spottingprecision of the droplet material is sufficiently confirmed by using thedroplet material spotting precision test substrate for the color filterand then improved. As a result, the droplet material can be preciselyapplied to the color element, producing the color filter having highcontrast without a pixel defect and irregularity in color.

The present invention provides a light emission substrate of the presentinvention that can include a pixel region having a bank region and alight emission region partitioned by the bank region, a spottingprecision test region positioned apart from the pixel region, afunctional layer provided in the light emission region, and a spottingprecision test layer provided in the spotting precision test region.

In the light emission substrate of the present invention, the pixelregion can mean a region including pixels used for the light emissionsubstrate. The spotting precision test region of the light emissionsubstrate can mean a region in which the pixels are not formed, or aregion including pixels not used for as pixels for the light emissionsubstrate. The functional layer can mean a layer including a luminescentlayer, and a hole transport/injection layer according to demand.

The light emission substrate of the present invention can include thespotting precision test layer provided in the spotting precision testregion, and thus the spotting precision test of the droplet material canbe performed on the spotting precision test layer, thereby permittingthe droplet material to be precisely applied to a predetermined regionin the pixel region. Therefore, the light emission substrate of thepresent invention has sufficient light shielding performance in the bankregion, and causes no color mixing in the light emission region, therebycausing neither pixel defect nor irregularity in color tone, and highcontrast. This light emission substrate is described in detail below.

The present invention can provide a light emission substrate of thepresent invention that includes a pixel region having a partition regionand a light emission region surrounded by the partition region, afunctional layer formed in the light emission region by discharging adroplet material, a peripheral region arranged adjacent to the pixelregion, an evaluation region included in the peripheral region andhaving a shape corresponding to the shape of the light emission region,and a layer provided in the peripheral region to cover the evaluationregion and having the property of expelling the droplet material.

In the light emission substrate of the present invention, the evaluationregion can mean a region in which the spotting precision test of thedroplet material is performed.

The light emission substrate of the present invention includes the layerprovided in the peripheral region to cover the evaluation region andhaving the property of expelling the droplet material, and thus thespotting precision test of the droplet material can be performed on thelayer, thereby permitting the droplet material to be precisely appliedto a predetermined region in the pixel region. Therefore, the lightemission substrate of the present invention has sufficient lightshielding performance in the partition region, and causes no colormixing in the light emission region, thereby causing neither pixeldefect nor irregularity in color tone, and high contrast.

The present invention can include a light emission substrate of thepresent invention that includes a pixel region having a partition regionand a plurality of light emission regions surrounded by the partitionregion, a functional layer formed in the light emission regions bydischarging a droplet material, a peripheral region arranged adjacent tothe pixel region and having a light shielding region, and an evaluationregion included in the peripheral region and having a shapecorresponding to the shape of the light emission regions. The pluralityof light emission regions and the evaluation region are arrayed.

The light emission substrate of the present invention can include theevaluation region and the plurality of transmitting region, which arearrayed, and thus the spotting precision test of the droplet materialcan be performed on the evaluation region, thereby permitting thedroplet material to be precisely applied to a predetermined region inthe pixel region. Therefore, the light emission substrate of the presentinvention has sufficient light shielding performance in the partitionregion, and causes no color mixing in the light emission region, therebycausing neither pixel defect nor irregularity in color tone, and highcontrast.

By using the light emission substrate of the present invention, thespotting precision of the droplet material is measured in the spottingprecision test region by forming a convex layer by spotting the dropletmaterial on the spotting precision test layer. In this measurementmethod, the convex layer is formed on the spotting precision test layerprovided in the spotting precision test region of the light emissionsubstrate of the present invention.

The light emission substrate of the present invention may have any ofthe following forms. For example, the functional layer can be formedbetween a pair of electrodes. Additionally, the bank region can beformed by laminating in turn a first insulating layer and a resin layer.

In this case, the spotting precision test region includes a secondinsulating layer, and the second insulating layer constituting thespotting precision test region is formed at the same height from asubstrate as the first insulating layer constituting the bank, and hasthe same pattern as the first insulating layer.

Additionally, each of the pixel region and the spotting precision testregion includes a switching element, and the switching element formed inthe spotting precision test region has the same structure as theswitching element formed in the pixel region.

A vernier layer can be provided in the spotting precision test region.In this case, the switching element formed in the pixel region includesa metal wiring layer, and the vernier layer can be provided at the sameheight from the substrate as the metal wiring layer.

A convex layer can be formed on the spotting precision test layerprovided in the spotting precision test region.

The above forms have substantially the same function and effect as thecolor filter of the present invention.

A droplet material spotting precision test substrate for a lightemission substrate of the present invention including a switchingelement formed on a substrate, an electrode layer connected to theswitching element, a bank insulating layer having a predeterminedpattern, and a spotting precision test layer formed on the electrodelayer.

The droplet material spotting precision test substrate for the lightemission substrate of the present invention has substantially the samefunction and effect as the droplet material spotting precision testsubstrate for the color filter of the present invention.

By using the droplet material spotting precision test substrate for thelight emission substrate of the present invention, the spottingprecision of the droplet material is measured by forming a convex layerby spotting the droplet material on the spotting precision test layer.In this measurement method, the convex layer is formed on the spottingprecision test layer of the droplet material spotting precision testsubstrate for the light emission substrate of the present invention.

Furthermore, a vernier layer can be provided on the droplet materialspotting precision test substrate for the light emission substrate ofthe present invention.

In this case, the vernier layer can be made of a metal layer. Thisconstruction has substantially the same function and effect as thedroplet material spotting precision test substrate for the color filterof the present invention.

The invention can provide a method of producing a light emissionsubstrate including the steps of forming a bank region having apredetermined matrix pattern in a pixel region, forming a spottingprecision test layer in a spotting precision test region positionedapart from the pixel region, and forming a functional layer in a regionpartitioned by the bank region in the pixel region to form a lightemission region partitioned by the bank region.

The method of producing the light emission substrate of the presentinvention can produce the light emission substrate having neither pixeldefect nor irregularity in color tone, and high contrast by a simpleprocess.

The method of producing the light emission substrate of the presentinvention may have any of the following forms. For example, the methodmay further comprise the step of forming a pair of electrode layers forapplying a charge to the functional layer in the pixel region.

In the step of forming a bank region, the bank region can be formed bylaminating a resin layer on a first insulating layer. In this case, thestep includes the step of forming the first insulating layer in thepixel region and forming a second insulating layer in the spottingprecision test region. The first insulating layer and the secondinsulating layer can be formed at the same height from the substrate andformed in the same pattern.

In this case, in the step of forming a bank region, the resin layer canbe formed by forming a photosensitive resin layer in the pixel regionand then patterning the photosensitive resin layer by photolithography.

In this case, the step of forming a bank region of forming the resinlayer and the step of forming the spotting precision test layer can beperformed in the same step.

The method may further include the step of forming switching elementshaving the same structure in the pixel region and the spotting precisiontest region.

The method may further include the step of spotting droplets containingthe droplet material on the spotting precision test layer to form aconvex layer in the spotting precision test region.

The step of forming the bank region may include the step of forming thevernier layer in the spotting precision test region of the substrate.

In this case, in the step of forming switching elements, the switchingelement provided in the pixel region includes a metal wiring layer, andthe vernier layer can be formed at the same height from the substrate asthe metal wiring layer.

The step of forming a functional layer may include the step of applyingthe droplet material to a region partitioned by the bank region by usinga droplet material discharge head to form the functional layer.

The above forms have substantially the same function and effect as themethod of producing the color filter of the present invention.

The present invention can include a method of producing a dropletmaterial spotting precision test substrate for a light emissionsubstrate of the present invention can include the step of forming aswitching element, an electrode layer, and a bank insulating layerhaving a predetermined pattern on a substrate, and forming a spottingprecision test layer on the electrode layer.

The method of producing the droplet material spotting precision testsubstrate for the light emission substrate of the present invention hassubstantially the same function and effect as the method of producingthe droplet material spotting precision test substrate for the colorfilter of the present invention.

The method of producing the droplet material spotting precision testsubstrate for the light emission substrate of the present invention mayhave any of the following modes. For example, the step of forming thespotting precision test can include the step of forming the spottingprecision test layer on the electrode layer and the bank insulatinglayer.

The method may further include the step of spotting droplets containingthe droplet material on the spotting precision test layer to form aconvex layer.

The step of forming the spotting precision test can include the step offorming a photosensitive resin layer and then patterning the resin layerby photolithography to form the spotting precision test layer.

The step of forming the switching element can include the step offorming a vernier layer on the substrate.

The method described above has substantially the same function andeffect as the method of producing the droplet material spottingprecision test substrate for the color filter of the present invention.

The present invention provides an electrooptic device including thecolor filter of the present invention, a counter substrate disposed witha predetermined space between the color filter and the countersubstrate, and an electrooptic material layer disposed between the colorfilter and the counter substrate.

In this case, by using a liquid crystal material layer as theelectrooptic material layer, a liquid crystal display device having ahigh contrast without a pixel defect such as irregularity in color tonecan be formed.

An electrooptic device of the present invention can include the lightemission substrate of the present invention, wherein the functionallayer constituting the light emission substrate can emit light byelectroluminescence.

An electronic apparatus of the present invention can also include theabove electrooptic device of the present invention.

In the electrooptic device and the electronic apparatus of the presentinvention, the function and effect of the color filter or the lightemission substrate of the present invention are reflected, therebyachieving a display with high contrast without a pixel defect such asirregularity in color tone.

The present invention can provide a film deposition method of thepresent invention including forming a spotting precision confirmationpattern in a spotting precision test region positioned apart from a filmformation region, forming a spotting precision test layer to cover atleast the spotting precision confirmation pattern in the spottingprecision test region, forming a convex layer by discharging a dropletmaterial to a position on the spotting precision test layer, whichcorresponds to the spotting precision confirmation pattern, andevaluating spotting precision based on a relative position between thespotting precision confirmation pattern and the convex layer.

The film deposition method of the present invention including the stepof evaluating spotting precision based on a relative position betweenthe spotting precision confirmation pattern and the convex layer, andthus the spotting precision of the droplet material can be preciselyevaluated. Therefore, film deposition can be made with high precision.

The present invention also includes a film deposition method of thepresent invention including the steps of forming a spotting precisionconfirmation pattern in a spotting precision test region positionedapart from a film formation region, forming a spotting precision testlayer to cover at least the spotting precision confirmation pattern inthe spotting precision test region, forming a plurality of convex layersby discharging a droplet material to a position on the spottingprecision test layer, which corresponds to the spotting precisionconfirmation pattern, and evaluating spotting precision based on arelative position between the plurality of convex layers.

The film deposition method of the present invention includes the step ofevaluating spotting precision based on a relative position between theplurality of convex layers, and thus the spotting precision of thedroplet material can be precisely evaluated. Therefore, film depositioncan be made with high precision.

In the above film deposition method, the spotting precision test layercan be formed to have the property of repelling the droplet material.

The present invention can include a film deposition apparatus of thepresent invention including a nozzle for discharging a droplet material.

A spotting precision confirmation pattern is formed in a spottingprecision test region positioned apart from a film formation region, aspotting precision test layer is formed to cover at least the spottingprecision confirmation pattern in the spotting precision test region, aconvex layer is formed by discharging, from the nozzle, the dropletmaterial to a position corresponding to the spotting precisionconfirmation pattern on the spotting precision test layer formed tocover at least the spotting precision confirmation pattern, and spottingprecision is evaluated based on a relative position between the spottingprecision confirmation pattern and the convex layer.

The film deposition apparatus of the present invention can evaluatespotting precision based on a relative position between the spottingprecision confirmation pattern and the convex layer, and thus thespotting precision of the droplet material can be precisely evaluated.Therefore, film deposition can be made with high precision.

The present invention can also include a film deposition apparatus ofthe present invention having a nozzle for discharging a dropletmaterial.

A spotting precision confirmation pattern is formed in a spottingprecision test region positioned apart from a film formation region, aspotting precision test layer is formed to cover at least the spottingprecision confirmation pattern in the spotting precision test region, aplurality of convex layers are formed by discharging, from the nozzle, adroplet material to a position corresponding to the spotting precisionconfirmation pattern on the spotting precision test layer formed tocover at least the spotting precision confirmation pattern, and spottingprecision is evaluated based on a relative position between theplurality of convex layers.

The film deposition apparatus of the present invention can evaluatespotting precision based on a relative position between the plurality ofconvex layers, and thus the spotting precision of the droplet materialcan be precisely evaluated. Therefore, film deposition can be made withhigh precision.

In the above film deposition apparatus, the spotting precision testlayer can be formed to have the property of repelling the dropletmaterial.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numerals reference like elements, and wherein:

FIG. 1 is a partial plan view schematically showing a color filteraccording to a first embodiment of the present invention;

FIG. 2 is a partial sectional view schematically showing a portion shownin FIG. 1, taken along line A—A in FIG. 1;

FIGS. 3(A) to (D) are partial sectional views schematically sowing thesteps for producing the color filter shown in FIGS. 1 and 2;

FIGS. 4(A) to (D) are partial sectional views schematically sowing thesteps for producing the color filter shown in FIGS. 1 and 2;

FIG. 5 is an enlarged partial plan view of the vicinity of line A—A inFIG. 1, schematically showing the color filter obtained by the stepsshown in FIGS. 3 and 4;

FIG. 6 is a partial plan view schematically showing a color filteraccording to a second embodiment;

FIG. 7 is a partial sectional view schematically showing a portion shownin FIG. 6, taken along line A—A in FIG. 6;

FIGS. 8(A) to (D) are partial sectional views schematically sowing thesteps for producing the color filter shown in FIGS. 6 and 7;

FIGS. 9(A) to (D) are partial sectional views schematically sowing thesteps for producing the color filter shown in FIGS. 6 and 7;

FIG. 10 is an enlarged partial plan view of the vicinity of line A—A inFIG. 6, schematically showing the color filter obtained by the stepsshown in FIGS. 8 and 9;

FIG. 11 is a partial plan view schematically showing a droplet materialspotting precision test substrate for a color filter according to athird embodiment;

FIG. 12 is a partial sectional view schematically showing a portionshown in FIG. 11, taken along line A—A in FIG. 11;

FIG. 13 is an enlarged partial plan view of the vicinity of line A—A inFIG. 11, schematically showing the color filter obtained by the stepsfor producing the droplet material spotting precision test substrate forthe color filter according to the third embodiment;

FIG. 14 is a sectional view schematically showing a liquid crystaldisplay device as an example of an electrooptic device according to afourth embodiment of the present invention;

FIG. 15 is a sectional view schematically showing an EL display deviceas an example of an electrooptic device according to a fifth embodimentof the present invention;

FIG. 16 is a sectional view schematically showing the light emissionsubstrate shown in FIG. 15;

FIGS. 17(A) to (C) are partial sectional views schematically sowing thesteps for producing the light emission substrate shown in FIG. 16;

FIGS. 18(A) to (C) are partial sectional views schematically sowing thesteps for producing the light emission substrate shown in FIG. 16;

FIG. 19 is a perspective view showing a digital still camera as anexample of an electronic apparatus according to a sixth embodiment ofthe present invention;

FIGS. 20(A) to (C) are drawings showing examples of electronicapparatuses according to the sixth embodiment of the present invention,in which FIG. 20(A) shows a cellular phone, FIG. 20(B) shows awristwatch, and 20(C) shows a portable information apparatus; and

FIG. 21 is a partial plan view schematically showing a droplet materialspotting precision test substrate for a light emission substrateaccording to a seventh embodiment of the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

FIG. 1 is a partial plan view schematically showing a color filteraccording to a first embodiment of the present invention, and FIG. 2 isa partial sectional view schematically showing a portion taken alongline A—A in FIG. 1.

A color filter 1000 of this embodiment can include a transparentsubstrate 10, and a pixel region 100 and a peripheral region formed onthe substrate 10. The peripheral region represents a region disposedadjacent to the pixel region 100 and including a light shielding region.The peripheral region includes a spotting precision test region 200.Namely, the spotting precision test region 200 is positioned apart fromthe pixel region 100. Although, in this embodiment, the spottingprecision test region 200 is formed in the outer periphery of the pixelregion 100, the position of the spotting precision test region 200 isnot limited to this position.

As shown in FIGS. 1 and 2, the pixel region 100 includes a lightshielding region 20 and a transmitting region 30 partitioned by thelight shielding region 20. The light shielding region 20 is a regionwhich substantially does not transmit light (visible light), and thetransmitting region 30 is a region which can transmit light. As shown inFIG. 1, the light shielding region 20 and the transmitting region 30 arearrayed in a predetermined matrix pattern in the pixel region 100.

The light shielding region 20 can include a first light shielding layer22 and a bank layer 24 formed on the first light shielding layer 22. Thetransmitting region 30 can include a color element 32. The color element32 is formed on, for example, the substrate 10.

First, the light shielding region 20 is described.

The first light shielding layer 22 constituting the light shieldingregion 20 is formed in the predetermined matrix pattern on the substrate10. The first light shielding layer 22 has sufficient light shieldingperformance. The material for the first light shielding layer 22 is notlimited, and a metal, a resin, and the like can be used as long as itfunctions as a black matrix. As the material for the first lightshielding layer 22, a metal is preferred because sufficient and uniformlight shielding performance can be obtained by a thin layer. It shouldbe understood that the metal used for the first light shielding layer 22is not limited, and it can be selected in consideration of theefficiency of all steps comprising deposition and photo-etching. As sucha metal, for example, chromium, nickel, aluminum, etc., which are usedfor the process of processing an electronic device, are preferably used.When the first light shielding layer 22 is made of a metal, with athickness of 0.1 μm or more, the sufficient light shielding performancecan be obtained. In consideration of the adhesion and brittleness of themetal layer, the thickness is more preferably 0.5 μm or less.

The bank layer 24 is formed on the first light shielding layer 22 andhas the predetermined matrix pattern. The bank layer 24 partitions aregion into parts in each of which a color element is formed, andprevents mixing (color mixing) of the colors of adjacent parts of thecolor element. Therefore, the thickness of the bank layer 24 is setbased on the relationship with the height of a droplet material layer asa coloring material so as to prevent the droplet material fromoverflowing. From this viewpoint, the bank layer 24 is preferably formedin a thickness, for example, in the range of 1 to 5 μm.

The bank layer 24 comprises a resin layer which can be processed byphotolithography. Such a photosensitive resin does not necessarily havea large angle of contact with water and excellent water-repellency orlight shielding performance, and be selected from a wide range. As theresin for forming the bank layer 24, for example, photosensitive resincompositions containing a urethane resin, an acryl resin, a novolacresin, a cardo resin, a polyimide resin, polyhydroxystyrene, polyvinylalcohol, or the like can be used.

Next, the transmitting region 30 is described. The transmitting region30 is a region partitioned by the light shielding region 20. Thetransmitting region 30 comprises the color element 32.

The color elements 32 can include a plurality of color elements 32 r, 32g and 32 b having the primary colors red, green and blue, respectively.The color elements 32 are arranged in, for example, a stripe pattern, adelta pattern, or a mosaic pattern, the continuous three color elementsforming one pixel. Each of the color elements 32 comprises a coloredlayer containing, for example, a pigment or dye.

The spotting precision test region 200 is included in the peripheralregion. Since the spotting precision test region 200 is included in theperipheral region and surrounded by a light shielding layer (a secondlight shielding layer 122) of the peripheral region, the spottingprecision test region 200 includes a region having a shape correspondingto the shape of the transmitting region 30. In the peripheral region,the region surrounded by the light shielding region is formed in anarray. Specifically, as shown in FIG. 2, the spotting precision testregion 200 comprises the second light shielding layer 122 (lightshielding region) and a spotting precision test layer 26.

The second light shielding layer 122 constituting the spotting precisiontest region 200 is formed in a predetermined matrix pattern on thesubstrate 10. The second light shielding layer 122 can be formed in thesame pattern as the first light shielding layer 22 constituting thepixel region 100. In this embodiment, the second light shielding layer122 and the first light shielding layer 22 have the same pattern, andare formed in the same step. Namely, like the first light shieldinglayer 22, the second light shielding layer 122 has sufficiently lightshielding performance, and the material for the second light shieldinglayer 122 is not limited. As the material, a metal, a resin, etc. can beused as long as the second light shielding layer 122 functions as ablack matrix.

The spotting precision test layer 26 is provided in the peripheralregion so as to cover the region surrounded by the light shieldingregion (the second light shielding layer 122) of the peripheral region,and has the property of repelling the droplet material. The spottingprecision test layer 26 is provided in the spotting precision testregion 200 so as to cover at least the second light shielding layer 122.In the color filter 1000 of this embodiment, the spotting precision testlayer 26 is formed on the substrate 10 so as to cover the second lightshielding layer 122.

The spotting precision test layer 26 is used for measuring the spottingprecision of the droplet material by spotting the droplet material onthe surface of the layer 26. The spotting precision test region 200comprises a region (evaluation region) partitioned by the second lightshielding layer 122. In this embodiment, the region partitioned by thefirst light shielding layer 22 and the region partitioned by the secondlight shielding layer 122 have the same pattern.

In order to securely measure the spotting precision of the dropletmaterial, the surface of the spotting precision test layer 26 must havewater-repellency to the droplet material. The term “water repellency tothe droplet material” can mean low wettability with the dropletmaterial. In order to impart water repellency to the droplet material tothe surface of the spotting precision test layer 26, the spottingprecision teat layer 26 is formed by using a material having waterrepellency to the droplet material, or the surface of the spottingprecision test layer 26 is treated to impart water repellency to thedroplet material, for example, by fluorination by plasma treatment, orthe like. In this embodiment, the spotting precision test layer 26 canbe formed by using the same material as the bank layer 24 constitutingthe pixel region 10.

The spotting precision test layer 26 is not necessarily formed over theentire region of the spotting precision test region 200, it may beformed at least in a region of the spotting precision test region 200,in which the spotting test of the droplet material is performed, namely,a region in which the droplet material is spotted.

The method of producing the color filter of this embodiment is describedwith reference to FIGS. 3 to 5. FIGS. 3 and 4 are sectional viewsschematically showing the layer structures in the respective steps,taken along line B—B in FIG. 1. FIG. 5 is an enlarged partial plan viewof the vicinity of line A—A in FIG. 1, schematically showing the colorfilter obtained the steps shown in FIGS. 3 and 4.

As shown in FIG. 3(A), a metal layer 220 is deposited to a thickness of0.1 to 0.5 μm on the pixel region 100 and the spotting precision testregion 200 of the transparent substrate 10 by a dry plating method, forexample, a sputtering method, a vapor deposition method, or a chemicalvapor deposition method. As described above, any of various metals suchas chromium, nickel, aluminum, and the like can be used as a materialfor the metal layer 220. Then, a resist layer R1 having a predeterminedpattern is formed on the surface of the metal layer 220 byphotolithography. The photolithography process is performed for thepixel region 100 and the spotting precision test region 200 by using thesame mask pattern. Then, the metal layer 220 is patterned by etchingusing the resist layer R1 as a mask. In this way, as shown in FIG. 3(B),the first and second light shielding layers 22 and 122 having thepredetermined matrix pattern are respectively formed on the pixel region100 and the spotting precision test region 200 of the substrate 10. Thefirst and second light shielding layers 22 and 122 have the samepattern.

Next, as shown in FIG. 3(C), a resin layer 240 is formed on the firstand second light shielding layers 22 and 122 respectively formed in thepixel region 100 and the spotting precision test region 200 of thesubstrate 10. The resin layer can be formed by using a negative orpositive resist. The resin layer 240 is made of, for example, anurethane or acrylic photo-curing (negative) photosensitive resin. Then,the resin layer 240 is patterned by exposure and development using aphoto-mask M1. As a result, as shown in FIG. 3(D), the bank layer 24 isformed in the pixel region 100 to form the light shielding region 20,and the spotting precision test layer 26 is formed in the spottingprecision test region 200. The structures of the bank layer 24 and thespotting precision test layer 26 have been described above, and thus adescription thereof is omitted. In this step, a color element formationregion 330 partitioned by the light shielding region 20 is formed in apredetermined matrix pattern in the pixel region 100.

Next, according to demand, the exposed surface of the substrate 10 istreated before the subsequent step of forming the color element. Thesurface can be treated by a method such as ultraviolet irradiation,plasma irradiation, laser irradiation, and the like. In this surfacetreatment, contaminants adhering to the exposed surface 10 a of thesubstrate 10 can be removed to decrease the angle of contact between thesurface 10 a and water, improving wettability with the droplet material.Specifically, a difference between the angle of contact between theexposed surface 10 a of the substrate 10 and water and the angle ofcontact between the surface of the bank layer 24 and water is preferably15° or more. In this way, by controlling the angle of contact betweenthe exposed surface 10 a of the substrate 10 and water and the angle ofcontact between the surface of the bank layer 24 and water, the dropletmaterial can be applied to the exposed surface 10 of the color elementformation region 330 with good adhesion, and an overflow of the dropletmaterial beyond the bank layer 24 can be prevented by the dropletmaterial-repelling property of the bank layer 24. Also, the occurrenceof nonuniformity in the thickness due to pulling of the droplet materialby the bank layer is suppressed in the course of drying of the dropletmaterial.

As the surface treatment method, an inline plasma irradiation-systemsurface treatment method is preferably used because it is suitable forforming a line process.

Next, the droplet material used for forming the color elements 32 isspotted on the spotting precision test layer 26 in the spottingprecision test region 200 to measure spotting precision of the dropletmaterial before the color element 32 is formed in the pixel region 100.

In this embodiment, as the method of applying the droplet material, adroplet material discharge method using a droplet material dischargehead is used. In order to precisely spotting the droplet material in thefine color element formation region 330, for example, of a 50-μm square,the droplet material discharge method capable of making the finedroplets discharged, and controlling the number of the dropletsdischarged is optimum.

When the droplet material is applied by the droplet material dischargemethod, the droplet material is not spotted at an estimated position dueto the following causes. The conceivable causes are that the dropletmaterial discharge head is disposed obliquely, that the nozzle used fordischarging the droplet material is inclined, that the droplet materialis discharged obliquely from the nozzle, and that the relative positionbetween the substrate and the droplet material discharge head isdeviated. By evaluating the spotting precision of the droplet materialby the method below, these causes can be cleared for improving thespotting precision of the droplet material.

First, as shown in FIG. 4(A), the droplet material is applied to thespotting precision test layer 26 in the spotting precision test region200 to form a convex droplet material layer 320. The convex layer 320 isformed on the portion of the spotting precision test layer 26, which isnot positioned above the second light shielding layer 122. Namely, theconvex layer 320 is spotted in the region of the spotting precision testlayer 26, which is surrounded by the edge 122 a of the second lightshielding layer 122 (refer to FIG. 5). As shown in FIG. 5, the spottingprecision is evaluated by the relative position between the convex layer320 and the edge 122 a of the second light shielding layer 122 and/orthe relative position between a plurality of the spotted convex layers320. When the spotting precision is evaluated by the relative positionof a plurality of the convex layers 320, as shown in FIG. 5, a pluralityof the convex layers 320 are formed on the spotting precision test layer26, and the spotting precision is evaluated by the relative positionbetween the plurality of the convex layers 320.

In this embodiment, the first and second light shielding layers 22 and122 respectively formed in the pixel region 100 and the spottingprecision test region 200 have the same pattern. Namely, the regionsrespectively partitioned by the first and second light shielding layers22 and 122 have the same pattern. Specifically, as shown in FIG. 4(A),the first and second light shielding layers 22 and 122 are formed sothat the width h_(a) (the width of the color element formation region330) between the adjacent regions of the first light shielding layer 22is substantially the same as the width h_(b) between the adjacentregions of the second light shielding layer 122. Therefore, when theconvex layer 320 is spotted on the region of the spotting precision testlayer 26, which is surrounded by the edge 122 a of the second lightshielding layer 122, the spotting precision of the droplet material canbe evaluated on the assumption that the droplet material is spotted onthe color element formation region 330 of the pixel region 100.

When the result of the spotting precision of the droplet material isbad, adjustment is performed for improving the spotting precisionaccording to demand.

Then, the color element 32 for actually forming pixels is formed. First,as shown in FIG. 4(B), a droplet material layer is formed in the pixelregion 100 by applying the droplet material to the color elementformation region 330 partitioned by the first light shielding layer 22and the bank layer 24 to form the color element 32 (32 g, 32 r, 32 b).In this embodiment, as the method of applying the droplet material, thedroplet discharge method used for the above-described droplet materialspotting precision test is used.

In order to precisely apply fine droplets to target positions (theexposed surface 10 a of the substrate 10), the droplet size is firstcontrolled to the size of the exposed surface 10 a of the color elementformation region 330 as a target. The droplet size is preferablycontrolled to 6 to 30 pico-liters, for example, for a 50 μm-square colorelement formation region 330. In consideration of throughput, thedroplet size is more preferably 12 to 20 pico-liters. In order todischarge the droplets from the droplet material discharge head andprecisely apply the droplets to the target, conditions are preferablycontrolled to prevent breakage of the droplets during flying, and tocause the droplets to fly straight.

In the present invention, in order to obtain the droplet material layerhaving a uniform thickness after adhesion, drying and curing, thefollowing technique is preferably performed for improving levelingproperty in the course of drying.

One means is a method of adding a high-boiling-point solvent to thedroplet material to decrease the drying speed. As the high-boiling-pointsolvent, at least one can be selected from butylcarbitol acetate,methoxybutyl acetate, ethoxyethyl propionate, and methoxy-2-propylacetate. In consideration of dispersibility of a pigment or solubilityof a dye, the solvent can be selected from a wide range solvents havinga boiling point of 150 to 300° C.

Another technique is a method of controlling the drying speed of theapplied droplet material. After the droplet material is applied,evaporation of a low-boiling-point solvent proceeds to increase theviscosity under leveling, and the resin component containing a pigmentof dye is thermally cured by crosslinking. As a drying condition, atleast either setting in a natural atmosphere or pre-baking at 40 to 100°C. can be combined with final baking at 150 to 300° C. according to theproperties of the droplet material. The droplet material has specificviscosity, surface tension, and fluidity. Therefore, in order to obtaina uniform thickness after drying, the range and combination of thedrying condition are selected according to the specific properties ofthe droplet material. When the dry curing condition does not match withthe properties of the droplet material, the thickness of the colorelement is easily made nonuniform to cause irregularity in the pixelcolor tone.

In this embodiment, the color element 32 is formed for each of the red,green and blue colors. The formation order the colors of the colorelement is not limited. For example, the green color element 32 g isfirst formed, and then either of the red color element 32 r and the bluecolor element 32 g is formed. Finally, the remaining color element isformed.

The color element can be formed for the red, green and blue colors atthe same time by selecting a droplet material discharge-system colorhead or a plurality of heads.

As shown in FIG. 4(C), after the color element 32 is formed, an overcoatlayer 40 is formed for obtaining a smooth surface. Furthermore, as shownin FIG. 4(D), a common electrode 50 is formed on the overcoat layer 40to obtain the color filter 1000 according to demand. The overcoat layer40 and the common electrode 50 can be provided according to theconstruction of an electrooptic device to which the color filter isapplied.

The main operation and effect of the color filer of this embodiment aredescribed below.

(a) In the color filter of this embodiment, the spotting precision ofthe droplet material is evaluated by spotting the convex dropletmaterial layer 320 on the spotting precision test layer 26 in thespotting precision test region 200, and then the droplet material layer320 is spotted on the color element formation region 330 to form thecolor element 32 actually used as the pixels in the pixel region 100.Therefore, the color element 32 can be precisely applied to thepredetermined region.

Particularly, in the color filter of this embodiment, the region(evaluation region) partitioned by the second light shielding layer 122is provided in the spotting precision test region 200. In thisconstruction, when the droplet material layer 320 is spotted (refer toFIG. 4(A)), the spotting precision of the droplet material can beprecisely measured. As a result, the color element 32 can be preciselyformed to exhibit sufficient light shielding performance in the lightshielding region 20 and no color mixing in the transmitting region 30.Therefore, a pixel defect and irregularity in color tone do not occur,and the contrast is high.

(b) By proving the first light shielding layer 22 and the bank layer 24,the light shielding function and the color element dividing function canbe independently set, and thus both functions can be securely exhibited.As a result, the color filter of this embodiment causes less pixeldefect due to insufficient light shielding performance and color mixing.Furthermore, dividing the functions permits optimum materials forforming the first light shielding layer 22 and the bank layer 24 to beselected from a wide range, and is advantageous from the viewpoint ofproduction cost. Particularly, when the first light shielding layer 22comprises a metal layer, the uniform and sufficient light shieldingperformance can be obtained by a thin layer.

The method of producing the color filter of this embodiment mainly hasthe following operations and effects.

(a) In the method of producing the color filter of this embodiment, thespotting precision of the droplet material is evaluated by spotting theconvex droplet material layer (convex layer) 320 on the spottingprecision test layer 26 in the spotting precision test region 200, andthen the droplet material is spotted on the color element formationregion 330 to form the color element 32 actually used as the pixels inthe pixel region 100. Namely, the spotting precision of the dropletmaterial can be evaluated by a simple method, and the color elements 32are formed in the pixel region 1001 after the apparatus is controlled toimprove the spotting precision of the droplet material based on theevaluation result according to demand. Therefore, the color element 32can be precisely applied to the desired region. As a result, the lightshielding region 20 has sufficient light shielding performance, and thetransmitting region 30 has no color mixing. Therefore, the color filterhaving neither pixel defect nor irregularity in color tone, and highcontrast can be formed.

(b) By using the droplet material discharge method for forming the colorelement 32, the number of the patterning steps using photolithographycan be decreased to simply the process. Therefore, the color filter ofthis embodiment can be formed by a small number of steps. Furthermore,since the droplet material is deposited by the droplet materialdischarge method to form the color element 32, the droplet material canbe applied to only the necessary color element formation region. Thus,unlike photolithography patterning, the coloring material is not lost byremoving an unnecessary portion, thereby decreasing the cost of thecolor filter.

FIG. 6 is a partial plan view schematically showing a color filteraccording to a second embodiment of the present invention, and FIG. 7 isa partial sectional view schematically showing a portion taken alongline A—A in FIG. 6.

A color filter 1001 of this embodiment has a structure similar to thecolor filter 1000 shown in FIGS. 1 to 5 except that a vernier layer 28is formed on a spotting precision test region 200 of a substrate 10. Inthe color filer 1001, portions having substantially the same functionsas those of the color filter 1000 of the first embodiment are denoted bythe same reference numerals, and a description thereof is omitted.

As shown in FIGS. 6 and 7, the vernier layer 28 is formed in the region(evaluation region) partitioned by the second light shielding layer 122in the spotting precision test region 200. Although FIG. 6 shows thevernier layer 28 having a crucial planar shape, the planar shape of thevernier layer 28 is not limited to this, and various forms such as acircle, a triangle, a rectangle, and the like can be used. Furthermore,the spotting precision test layer 26 is formed on the vernier layer 28.

It should be understood that the material of the vernier layer 28, etc.are not limited as long as it can be discriminated from the convex layer320 side when the spotting precision test layer 26 and the convex layer320 are formed on the vernier layer 28, and a metal, a resin, and thelike can be used. When the vernier layer 28 is formed in the same stepas the first and second light shielding layers 22 and 122, the vernierlayer 28 is formed by using the same material as the first and secondlight shielding layers 22 and 122.

The method of producing the color filter 1001 of this embodiment isdescribed with reference to FIGS. 8 to 10. FIGS. 8 and 9 are sectionalviews schematically showing the layer structures in the respectivesteps, taken along line B—B in FIG. 6. FIG. 10 is an enlarged partialplan view of the vicinity of line A—A in FIG. 6, schematically showingthe color filter obtained the steps shown in FIGS. 8 and 9. In each ofthe production steps, substantially the same portions as the method ofproducing the color filter 1000 of the first embodiment are notdescribed in detail.

In this embodiment, the first and second light shielding layers 22 and122, and the vernier layer 28 are first formed in the same step. Asshown in FIG. 8(A), a metal layer 220 is deposited on the pixel region100 and the spotting precision test region 200 of the transparentsubstrate 10 by. Then, a resist layer R2 having a predetermined patternis formed on the surface of the metal layer 220 by photolithography.Next, the metal layer 220 is patterned by etching using the resist layerR2 as a mask. In this way, as shown in FIG. 8(B), the first lightshielding layer 22 having the predetermined matrix pattern is formed onthe pixel region 100 of the substrate 10, and the second light shieldinglayer 122 and the vernier layer 28 are formed in the spotting precisiontest region 200 of the substrate 10. In this step, the vernier layer 28is formed in the region (evaluation region) partitioned by the secondlight shielding layer 122.

The steps described below are the same as the steps for producing thecolor filter of the first embodiment. Namely, as shown in FIG. 8(C), aresin layer 240 is formed on the first and second light shielding layers22 and 122 respectively formed in the pixel region 100 and the spottingprecision test region 200 of the substrate 10. Then, the resin layer 240is patterned by exposure and development using a photo-mask M1. As aresult, as shown in FIG. 8(D), the bank layer 24 is formed in the pixelregion 100 to form the light shielding region 20, and the spottingprecision test layer 26 is formed in the spotting precision test region200. In this step, the color element formation region 330 partitioned bythe light shielding region 20 is formed in a predetermined matrixpattern. Next, according to demand, the surface of the substrate 10 istreated before the subsequent step of forming the color element.

Next, the droplet material used for forming the color element 32 isspotted on the spotting precision test layer 26 in the spottingprecision test region 200 to measure spotting precision of the dropletmaterial before the color element 32 is formed in the pixel region 100.In this embodiment, like in the first embodiment, the color element 32is formed by using the droplet material discharge method. Namely, inthis embodiment, the spotting precision of the droplet material ismeasured in the spotting precision test region 200 by the same method asthe first embodiment.

First, as shown in FIG. 9(A), the droplet material is applied to thespotting precision test layer 26 in the spotting precision test region200 to form a convex droplet material layer 320. As described above, thespotting precision of the droplet material is evaluated by the relativeposition between the convex layer 320 and the edge 122 a (refer to FIG.10) of the second light shielding layer 122 and the relative positionbetween a plurality of the spotted convex layers 320. In the colorfilter 1001 of this embodiment, the vernier layer 28 is formed on thesubstrate 10, and thus a deviation of the spot position of the dropletmaterial can be precisely determined by the relative position betweenthe convex layer 320 and the vernier layer 28, as shown in FIG. 5.

When the result of the spotting precision of the droplet material isbad, adjustment is performed for improving the spotting precisionaccording to demand, and then the color filter 1001 is produced by thesame production steps as the color filter of the first embodiment, asshown in FIGS. 9(B) to 9(D).

Beside the operations and effects of the color filter of the firstembodiment, the color filter 1001 of this embodiment is capable ofprecisely determining a deviation of the spot position of the dropletmaterial by the relative position between the convex layer 320 and thevernier layer 28 because the vernier layer 28 is formed on the substrate10.

FIG. 11 is a partial plan view schematically showing a droplet materialspotting precision test substrate for a color filter according to athird embodiment of the present invention, and FIG. 12 is a sectionalview schematically showing a portion taken along line A—A in FIG. 11.

A droplet material spotting precision test substrate 1002 for a colorfilter of this embodiment has a structure similar to the spottingprecision test region 200 constituting the color filter 1001 of thesecond embodiment. Namely, the droplet material spotting precision testsubstrate 1002 does not have the pixel region 100 shown in FIG. 6, buthas the spotting precision test region 200 shown in FIG. 6, which isformed over the entire surface. In the droplet material spottingprecision test substrate 1002 for a color filer, portions havingsubstantially the same functions as those of the color filter 1001 ofthe second embodiment are denoted by the same reference numerals, and adescription thereof is omitted.

The droplet material spotting precision test substrate 1002 for thecolor filter includes the spotting precision test region 200. Thespotting precision test region 200 includes the light shielding layer122, and the spotting precision test layer 26 formed to cover the lightshielding layer 122. The droplet material spotting precision testsubstrate 1002 is formed for a spotting precision test of the dropletmaterial. Like in the spotting precision test region 200 of the colorfiler 1000 of the first embodiment (refer to FIG. 2), the spottingprecision test region 200 provided in the spotting precision testsubstrate 1002 can include the region (evaluation region) partitioned bythe light shielding layer 122. In the process for producing the colorfilter, the spotting precision test for the droplet material for formingthe color element is carried out by using the droplet material spottingprecision test substrate 1002 before the color filter is actuallyproduced.

The droplet material spotting precision test substrate 1002 has the samestructure as the color filter to be actually produced except the pixelregion is not formed. Namely, the droplet material spotting precisiontest substrate 1002 is formed by using the same substrate as the colorfilter actually produced, and has the light shielding layer 122 havingthe same pattern as the light shielding layer formed in the color filteractually produced. Furthermore, the vernier layer 28 is formed in theregion surrounded by the light shielding layer 122 on the substrate 10,and the spotting precision test layer 26 is formed on the substrate 10.

The droplet material spotting precision test substrate 1002 for thecolor filter is produced by the same as the process for producing thespotting precision test region 200 in the color filter 1001 of thesecond embodiment. In this embodiment, the spotting precision test ofthe droplet material can be carried out by the same steps as the secondembodiment shown in FIG. 9. In this case, the spotting precision test ofthe droplet material is performed for the droplet material spottingprecision test substrate 1002 before the color filter is actuallyproduced.

FIG. 13 is an enlarged partial plan view of the vicinity of line A—A inFIG. 11, schematically showing the droplet material spotting precisiontest substrate 1002 after the droplet material spotting precision test.

Since the droplet material spotting precision test substrate 1002 hasthe same structure as the color filter actually produced, the spottingprecision test can be carried out in the same manner as the test for thecolor filter actually produced. Furthermore, in this embodiment, thespotting precision test is performed for the droplet material spottingprecision test substrate 1002 exclusively used as a test substratebefore the color filter is produced. The second light shielding layer122 having the same pattern and the color filter actually produced isformed in the droplet material spotting precision test substrate 1002.Therefore, the spotting precision of the droplet material issufficiently confirmed by a pre-test for the droplet material spottingprecision test substrate 1002, and then the color element can be formedin the color filter actually produced after the spotting precision isimproved. Thus, the color filter having neither pixel defect norirregularity in color tone, and high contrast can be produced.

FIG. 14 is a sectional view showing a color liquid crystal displaydevice as an example of an electrooptic device into which the colorfilter 1000 of the first embodiment is incorporated. FIG. 14 shows onlythe pixel region 100 of the color filter 1000.

The color liquid crystal display device 1100 generally includes thecolor filter 1000 and a counter substrate 80, which are combinedtogether, a liquid crystal composition 70 being sealed between bothmembers. In the liquid crystal display device 1100, TFT (thin filmtransistor) elements (not shown) and pixel electrodes 52, which areformed in a matrix on the inner surface of the substrate 80. The colorfilter 1000 is provided as the other substrate so that the color element32 having red, green and blue colors is arranged corresponding to thepixel electrodes 52. Furthermore, alignment films 60 and 62 arerespectively formed on the opposed surfaces of the substrate 80 and thecolor filter 1000. The alignment films 60 and 62 are rubbed to orientthe liquid crystal molecules in a predetermined direction. Also,polarizing plates 90 and 92 are respectively bonded to the outersurfaces of the substrate 80 and the color filer 1000. As a back light,a combination of a fluorescent lamp (not shown) and a scattering plateis generally used so that the liquid crystal composition is caused tofunction as an optical shutter for changing transmittance of the backlight to achieve a display.

Although, in the this embodiment, the example in which the color filter1000 of the first embodiment is incorporated into the liquid crystaldisplay device is described, a liquid crystal display device may beformed by incorporating the color filter 1001 of the second embodimentin place of the color filter 1000.

FIG. 15 is a sectional view showing a light emission substrate 1003 anda color EL display device 1200 as an example of an electrooptic deviceinto which the light emission substrate 1003 is incorporated. FIG. 16 isa plan view schematically showing the light emission substrate 1003shown in FIG. 15. In this embodiment, a description is made of anexample in which the light emission substrate 1003 is a color lightemission substrate. The light emission substrate 1003 has the samestructure as the color filter 1000 of the first embodiment, and portionshaving the same functions and effects as the color filter 1000 aredenoted by the same reference numerals. These portions are not describedbelow.

As shown in FIG. 15, the color EL display device 1200 comprises a base112, and the light emission substrate 1003 provided in the base 112.

The light emission substrate is 1003 outlined below. As shown in FIGS.15 and 16, the light emission substrate 1003 includes a pixel region 110and a peripheral region. The peripheral region means a region arrangedadjacent to the pixel region 110. The peripheral region includes aspotting precision test region 210. Namely, the spotting precision testregion 210 is positioned apart from the pixel region 110. The spottingprecision test region 210 is included in the peripheral region, andincludes an evaluation region having a shape corresponding to the shapeof a light emission region 230. First, the pixel region 110 isdescribed.

As shown in FIGS. 15 and 16, the pixel region 110 includes a bank region(partition region) 220, and the light emission region 230. The bankregion 220 and the light emission region 230 are formed on a base 111.The light emission region 230 is partitioned by the bank region 220.Specifically, as shown in FIG. 16, the light emission region 230 ispartitioned by the bank region 220 in the pixel region 110.

The pixel region 110 further comprises switching elements 202 formed onthe base 111.

The base 111 functions as a support and a plane for emitting light.Therefore, the base 111 is selected in consideration of lighttransmission properties and thermal stability. Examples of transparentsubstrate materials for the base 111 include glass, transparentplastics, and the like.

As the switching elements 202, for example, TFT elements can be used.The adjacent switching elements 202 are separated by an insulating layer221.

The light emission region 230 includes a function layer and a pair ofelectrodes comprising first and second electrode layers 227 and 229. Thefunction layer includes a luminescent layer, and if required, a holetransport/injection layer. In the light emission substrate 1003 of thisembodiment, the functional layer includes luminescent layers 42 (42 g,42 r, 42 b) and a hole transport/injection layer 204.

The luminescent layers 42 are arranged in a predetermined matrix patternand partitioned by the bank region 220. As shown in FIG. 15, theluminescent layers 42 are formed between the first electrode 227 and thesecond electrode layer 229. In this embodiment, the luminescent layers42 can include a plurality of luminescent layers 42 r, 42 g and 42 brespectively having the light primary colors, red, green and blue. Theseluminescent layers 42 are arranged in a predetermined pattern, forexample, a stripe pattern, a delta pattern, or a mosaic pattern, thecontinuous three color elements forming one pixel. In this embodiment,the luminescent layers 42 are formed by using a material which can emitslight by electroluminescence.

In the light emission substrate 1003 of this embodiment, as shown inFIG. 15, the hole transport/injection layer 204 can be formed betweenthe first electrode 227 and the luminescent layers 42. The “holetransport/injection layer” means a layer for transporting holes from ananode to the luminescent layers or effectively injecting the hole.

The bank region 220 is mainly formed for partitioning the luminescentlayers 42. As the bank region 220, a laminate comprising a bankinsulating layer (first insulating layer) 222 and a resin layer 224 canbe used. The bank insulating layer 222 comprises, for example, a siliconoxide layer. The resin layer 224 comprises, for example, polyimide. Thebank insulating layer 222 is laminated on the insulating layer 221, andthe resin layer 224 is formed on the bank insulating layer 222. The bankinsulating layer 222 serves as a component of the bank region 220 andhas the function to partition the light emission region 230 and separatethe adjacent portions of the first electrode layer 227.

The first and second electrode layers 227 and 229 are provided forapplying an electric charge to the luminescent layers 42. In thisembodiment, the case in which the first electrode layer 227 servers asan anode, and the second electrode layer 229 serves as a cathode isdescribed. The first electrode layer 227 can be formed by using a metalwith a high work function (for example, 4 eV or more), an alloy, anelectrically conductive compound, or a mixture thereof. For example, thefirst electrode layer 227 comprises a transparent conductive materialsuch as ITO, CuI, SnO₂, ZnO, or the like. The second electrode layer 229can be formed by using an electron injection metal, an alloy, anelectrically conductive compound, or a mixture thereof.

The spotting precision test region 210 is included in the peripheralregion. Since the spotting precision test region 210 is included in theperipheral region, and has a region having a shape corresponding to thelight emission region 230. The region having the shape corresponding tothe shape of the light emission region 230 is arrayed. Specifically, asshown in FIG. 15, the spotting precision test region 210 can include aspotting precision test layer 226. In the spotting precision test region210, like in the pixel region 110, the switching elements 202 formed onthe base 111, the bank insulating layer (second insulating layer) 22 forseparating the adjacent switching elements 202, the first electrodelayer 227 mainly formed on the bank insulating layer 222 and connectedto the switching elements 202, and the bank insulating layer 222 forseparating the adjacent regions of the first electrode layer 227 areformed.

The spotting precision test layer 226 is provided in the peripheralregion so as to cover the region having the shape corresponding to theshape of the light emission region 230, and has the property ofrepelling the droplet material. The spotting precision test layer 226can be formed by using the same material as the resin layer 224 of thebank region 220 constituting the pixel region 110. For example, when theresin layer 224 is made of a polyimide resin, the spotting precisiontest layer 226 can also be made of a polyimide resin.

Also, the bank insulating layer (second insulating layer) 222constituting the spotting precision test region 210 can be formed in thesame step as the bank insulating layer (first insulating layer) 222constituting the bank region 220 in the pixel region 110. Namely, thefirst bank insulating layer 222 constituting the spotting precision testregion 210 can be formed to the same height from the substrate 112 asthe second bank insulating layer 222 constituting the bank region 220 inthe pixel region 110, and has the same pattern as the pixel region 110.

Furthermore, the switching elements 202 formed in the spotting precisiontest region 210 can be formed in the same step as the switching elements210 formed in the pixel region 110, and have the same structure as inthe pixel region 110.

In the light emission substrate 1003 of this embodiment, as shown inFIG. 15, a vernier layer 228 is formed on the base 111. The vernierlayer 228 has the same function and effect as the vernier layerconstituting the color filter of the second embodiment. In the lightemission substrate 1003 of this embodiment, the vernier layer 228 isformed to the same height from the substrate 112 as a metal wiring layer(not shown) constituting the switching elements 202. In this case, thevernier layer 228 can be formed by using the same material as the metalwiring layer. For example, when the metal wiring layer is made ofchromium or aluminum, the vernier layer 228 can also be made of chromiumor aluminum.

Next, the operation and function of the color EL display device 1200comprising the light emission substrate 1003 shown in FIG. 15 aredescribed.

When a predetermined voltage is applied to the first electrode layer(anode) 227 and the second electrode layer (cathode) 229, electrons fromthe cathode 229 and holes from the anode 227 are injected into theluminescent layers 42. In the luminescent layers 24, the electrons andthe holes are re-combined to produce excitons, and the excitons areinactivated to emit light such as fluorescent light and phosphorescentlight.

The method of producing the light emission substrate 1003 of thisembodiment is described with reference to FIGS. 17 and 18. FIGS. 17(A)to (C) and FIGS. 18(A) to (C) are sectional partial views schematicallyshowing the respective steps for the light emission substrate 1003 shownin FIG. 16, taken along line C—C in FIG. 16.

As shown in FIG. 17(A), in the pixel region 110 and the spottingprecision test region 210, the switching elements 202, the insulatinglayer 221 for separating the adjacent switching elements 202, the firstelectrode layer 227, and the bank insulating layer (first and secondinsulating layer) 222 having the predetermined pattern are formed inturn on the base 111 by a known method. As shown in FIG. 17(A),apertures are formed in predetermined regions (positioned above theswitching elements 202) of the insulating layer 221 before the firstelectrode layer 227 is formed, and then the first electrode layer 227 isformed on the insulating layer 221 to electrically connect the switchingelements 202 to the first electrode layer 227. As shown in FIG. 16, inthe step described below, the light emission region 230 is formed in theportions where the bank insulating layer 222 is not formed.

Then, a photosensitive resin layer (not shown) is formed over the entiresurface, and then patterned by photolithography to form the resin layer224 on the bank insulating layer 222 in the pixel region 110, formingthe bank region 220. At the same time, in the spotting precision testregion 210, the bank insulating layer 222 and the spotting precisiontest layer 226 on the first electrode layer 227 are formed. By formingthe bank region 220, apertures are formed in the region where the lightemission region 230 is formed in the step described below. Namely, theapertures serve as a functional layer formation region 430. In otherwords, the functional layer formation region 430 is a region partitionedby the bank region 220, in which a functional layer (the luminescentlayers 42 and the hole transport/injection layer 204) is formed in thestep described below.

Then, as shown in FIGS. 17(B) and (C), the hole transport/injectionlayer 204 is formed in the functional layer formation region 430 byusing the droplet material discharge method using a droplet materialdischarge head 500 which is used in the droplet material dischargesystem. As the material 502 for forming the hole transport/injectionlayer 204, for example, a mixture of polyethylene dioxythiophene andpolystyrene sulfonate can be used. However, in this embodiment, the samehole transport/injection layer made of the same material is formed forcolor dots, a hole transport/injection material suitable for each of theluminescent layers may be used to form the hole transport/injectionlayer.

Next, the droplet material used for forming the luminescent layers 42 isspotted on the spotting precision test layer 226 in the spottingprecision test region 210 to measure spotting precision of the dropletmaterial before the luminescent layers 42 are formed in the pixel region110.

In this embodiment, the luminescent layers 42 are formed by the samedroplet material discharge method as that for forming the holetransport/injection layer 204.

When the droplet material is applied by the droplet material dischargemethod, as described above, the droplet material is not spotted at anestimated position due to the following causes. The conceivable causesare that the droplet material discharge head is disposed obliquely, thatthe nozzle used for discharging the droplet material is inclined, thatthe droplet material is discharged obliquely from the nozzle, and thatthe relative position between the substrate and the droplet materialdischarge head is deviated. By evaluating the spotting precision of thedroplet material by the method below, these causes can be cleared forimproving the spotting precision of the droplet material.

First, as shown in FIG. 18(A), the droplet material is applied to thespotting precision test layer 226 in the spotting precision test region210 to form a convex droplet material layer 420. The convex layer 420 isformed on the portion of the spotting precision test layer 226, which ispositioned above the bank shielding layer 222. Namely, the convex layer320 is spotted in the region inside the edge the edge 222 a of the bankshielding layer 222 (refer to FIG. 16). As shown in FIG. 16, thespotting precision is evaluated by the relative position between theconvex layer 420 and the edge 222 a of the bank shielding layer 222and/or the relative position between a plurality of the spotted convexlayers 420. When the spotting precision is evaluated by the relativeposition of a plurality of the convex layers 420, as shown in FIG. 16, aplurality of the convex layers 420 are formed on the spotting precisiontest layer 226, and the spotting precision is evaluated by the relativeposition between the plurality of the convex layers 420.

In this embodiment, the bank layer 222 has the same pattern in the pixelregion 110 and the spotting precision test region 210. Namely, when theconvex layer 420 is spotted on the region of the spotting precision testlayer 226, which is surrounded by the edge 222 a of the second banklayer 222, the spotting precision of the droplet material can beevaluated on the assumption that the droplet material is spotted on thefunctional layer formation regions 430 of the pixel region 110.

When the result of the spotting precision of the droplet material isbad, adjustment is performed for improving the spotting precisionaccording to demand.

Then, the luminescent layers 42 (42 g, 42 r, 42 b) for actually formingpixels are formed. First, as shown in FIG. 18(B), a droplet materiallayer for the red luminescent layer, a droplet material layer for thegreen luminescent layer and a droplet material layer for the blueluminescent layer are coated on the hole transport/injection layer 204by the droplet material discharge method. Then, a solvent is removed,and heat treatment is performed in a nitrogen atmosphere to cure orconjugate the droplet material compositions. As a result, the redluminescent layer 42 r, the green luminescent layer 42 g and the blueluminescent layer 42 b having the primary colors, red, green and blue,are formed, as shown in FIG. 18(C). The luminescent layers conjugated byheat treatment are insoluble in the solvent. The light emission region230 shown in FIG. 15 is formed by the above-described steps.

By using the droplet material discharge method, a fine pattern can besimply formed within a short time. Also, the thickness can be changed bychanging the sold concentration and the discharge amount of the dropletmaterial.

The hole transport/injection layer 204 may be continuously treated withoxygen gas and fluorocarbon plasma before the luminescent layers 42 areformed. This can form a fluoride layer on the hole transport/injectionlayer 204 to increase ionization potential, thereby providing an organicEL substrate with excellent efficiency of hole injection.

Also, according to the type of the luminescent material used, one or twocolor organic luminescent layers can be formed by the droplet materialdischarge method, and the other two or one color layer can be formed bya conventional coating method. In this method, even when the luminescentmaterial unsuitable for the droplet material discharge method is used, afull color organic EL substrate can be formed by combining with anotherorganic luminescent material used for the droplet material dischargemethod, increasing the degree of freedom of element design. As thecoating method other than the droplet material discharge method, aprinting method, a transfer method, a dipping method, a spin coatingmethod, a cast method, a capillary method, a roll coating method, a barcoating method, and the like can be used.

As shown in FIG. 15, a second electrode layer 229 is formed as acathode. As the second electrode layer 229, a metal thin film can beused. As the metal used for forming the second electrode layer 229, forexample, magnesium, silver, aluminum, lithium, or the like can be used.Besides these metals, other materials having a low work function canalso be used. For example, an alkali metal, an alkali earth metal suchas potassium or the like, and alloy containing any of theses metals canbe used, and a metal fluoride can also be used. The second electrodelayer 229 can be formed by vapor deposition or sputtering.

Furthermore, a protective film may be formed on the second electrodelayer 229. By forming the protective film, deterioration, damage andseparation of the second electrode layer 229 and the luminescent layers42 can be prevented.

Examples of the material for forming the protective film include anepoxy resin, an acrylic resin, liquid glass, and the like. Examples ofthe method of forming the protective film include a spin coating method,a cast method, a dipping method, a bar coating method, a roll coatingmethod, a capillary method, and the like.

The second electrode layer 229 can be provided according to theconstruction of an electrooptic device to which a light emitter isapplied. Then, the light emission substrate 1003 is cut at predeterminedpositions to form a plurality of light emitters.

In the above-described production method, a known material can be usedfor each of the layers. Also, the materials disclosed in Japanese PatentApplication Nos. 11-134320 and 11-250486 filed by the applicant can beused as the materials for the hole transport/injection layer, theluminescent layers, etc.

Although, in the above production method, the hole transport/injectionlayer and the luminescent layer, which constitute a color dot, areformed by the droplet material discharge method, only the luminescentlayer may be formed, or an electron transport/injection layer mayfurther be provided.

Like the droplet material spotting precision test substrate for thecolor filer of the third embodiment, a droplet material spottingprecision test substrate not having the pixel region 110 of the lightemission substrate 1003 of this embodiment can also be formed (refer tothe seventh embodiment below). By using the droplet material spottingprecision test substrate of the light emission substrate, the spottingprecision test of the droplet material can be performed for the dropletmaterial spotting precision test substrate comprising the firstelectrode layer 227 and the bank insulating layer 222 which respectivelyhave the same patterns as the light emission substrate actuallyproduced. Therefore, the luminescent layers of the light emissionsubstrate actually produced can be formed after the spotting precisionof the droplet material is sufficiently confirmed ad improved. As aresult, the light emission substrate having a high contrast without apixel defect and irregularity in color tone can be produced.

An example of an electronic apparatus using a liquid crystal displaydevice as an electrooptic device of the present invention is described.

A description is made of a digital still camera using the liquid crystaldisplay device 1100 of the fourth embodiment of the present invention asa finder. FIG. 19 is a perspective view showing the construction of thedigital still camera, and briefly showing the connection with anexternal apparatus.

In a usual camera, a film is exposed to an optical image of a subject,while in a digital still camera 2000, an image signal is produced byphotoelectric conversion of an optical image of a subject by an imagingdevice such as CCD (Charge Coupled Device) or the like. In the digitalstill camera 2000, the liquid crystal panel of the above-descried liquidcrystal display device 1100 is provided on the back (the front side ofFIG. 19) of a case 2202 so that a display is performed based on theimage signal from the CCD. Therefore, the liquid crystal display device1100 functions as the finder for displaying the subject. Also, a lightreceiving unit 2204 comprising an optical lens and the CCD is providedon the front side (the back side of FIG. 19) of the case 2202.

When a shutter button 2206 is pressed after the subject image displayedon the liquid crystal display device 1100 is confirmed by aphotographer, the image signal of the CCD is transmitted to a memory ofa circuit board 2208 and stored in the memory. In the digital stillcamera 2000, video signal output terminals 2212 and an input/outputterminal 2214 for data communication are provided on the side of thecase 2202. As shown in FIG. 19, according to demand, a televisionmonitor 2300 is connected to the video signal output terminals 2212, anda personal computer 2400 is connected to the input/output terminal 2214for data communication. Furthermore, the image signal stored in thememory of the circuit board 2208 is output to the television monitor2300 and the personal computer 2400 by a predetermined operation.

FIGS. 20(A), (B) and (C) are drawings showing the appearances of otherexamples of electronic apparatuses each using a liquid crystal displaydevice as the electrooptic device of the present invention. FIG. 20(A)shows a cellular phone 3000 comprising the liquid crystal display device1100 provided on the front plane. FIG. 20(B) shows a wristwatch 4000including the liquid crystal display device 1100 provided at the centerof the front plane of the body. FIG. 20(C) shows a portable informationapparatus 5000 including a display section comprising the liquid crystaldisplay device 1100, and an input section 5100.

Although not shown in the drawings, besides the liquid crystal displaydevice 1100, each of the electronic apparatuses can further includevarious circuits, such as a display information output source, a displayinformation processing circuit, a clock generating circuit, etc., and adisplay signal generating section including a power supply circuit forsupplying electric power to these circuits. For example, in the portableinformation apparatus 5000, the display signal produced by the displaysignal generating section is supplied the display section based on theinformation input from the input section 5100, forming a display image.

It should be understood that the electronic apparatus into which theliquid crystal display device 1100 of the present invention isincorporated is not limited to the digital still camera, the cellularphone, the wristwatch, and the portable information apparatus.Conceivable examples of electronic apparatuses include an electronicnotebook, a pager, a POS terminal, an IC card, a minidisk player, aliquid crystal projector, a personal computer (PC) for multimedia and anengineering work station (EWS), a notebook-size personal computer, awork processor, a television, a view finder-type or monitor directviewing-type video tape recorder, an electronic notebook, an electrictable calculator, a car navigation device, a device comprising a touchpanel, a watch, and the like.

From the viewpoint of the driving system, a simple matrix liquid crystaldisplay panel and a static driving liquid crystal display panel, whichdo not use the switching elements, and an active matrix liquid crystaldisplay panel using a three-terminal switching element such as a TFT(thin film transistor), or a tow-terminal switching element such as aTFD (thin film diode), can be used as the liquid crystal display panel.From the viewpoint of the electrooptic properties, various types ofliquid crystal panels such as a TN type, a STN type, a guest-host type,a phase transition type, a ferroelectric type, and the like can be used.

Although the devices according to the present invention are describedabove with reference to the specified embodiments, various modificationscan be made within the gist of the present invention. Although, in theabove-described embodiments, a description is made of the case in whichthe liquid crystal display device 1100 of the fourth embodiment of thepresent invention is used as the image display means (the electroopticdisplay section) of the electrooptic device, the present invention isnot limited to this. For example, the EL display device 1200 of thefifth embodiment of the present invention can also be used. In addition,the electrooptic device of the present invention can also be applied tovarious electrooptic means such as a small-size television using a thincathode ray tube or a liquid crystal shutter, an electroluminescenceplasma display, a CRT display, a FED (Field Emission Display) panel, anelectrophoretic display device, and the like.

FIG. 21 is a partial plan view schematically showing a droplet materialspotting precision test substrate 1004 for a light emission substrateaccording to the seventh embodiment.

The droplet material spotting precision test substrate 1004 for theliquid emission substrate of this embodiment has a structure similar tothe spotting precision test region 210 (refer to FIG. 15) constitutingthe light emission substrate 1003 of the fifth embodiment. Namely, thedroplet material spotting precision substrate 1004 shown in FIG. 21 doesnot comprise the pixel region 100 shown in FIG. 15, but includes thespotting precision test region 210 shown in FIG. 15, which is formedover the entire surface. In the droplet material spotting precision testsubstrate 1004 for the light emission substrate, the portions havingsubstantially the same functions as the light emission substrate 1003 ofthe fifth embodiment are denoted by the same reference numerals, and arenot described in detail below.

The droplet material spotting precision test substrate 1004 for thelight emission substrate includes a switching element 202 formed on abase 111, an electrode 227, a bank insulating layer 222, and a spottingprecision test layer 226. The electrode 227 is connected to theswitching element 202, and the spotting test layer 226 is formed on theelectrode 227. The bank insulating layer 222 has a predetermined patternand has the function to separate the adjacent regions of the electrode227.

The droplet material spotting precision test substrate 1004 is formedfor the spotting precision test of the droplet material. Namely, in theprocess for producing the light emission substrate, the spottingprecision test of the droplet material is carried out by using thedroplet material spotting precision test substrate 1004 before the lightemission substrate is actually produced.

The droplet material spotting precision test substrate 1004 has the samestructure as the light emission substrate to be actually produced exceptthe pixel region is not formed. Namely, the droplet material spottingprecision test substrate 1004 is formed by using the same substrate asthe light emission substrate actually produced. The bank insulatinglayer 226 and the electrode 227 respectively have the same patterns asthe bank insulating layer 226 and the electrode 227 of the lightemission substrate 1003 shown in FIG. 15, which is formed in the lightemission substrate actually produced. Furthermore, a vernier layer 228comprising a metal layer is formed on the base 111. Like in the lightemission substrate 1003 shown in FIG. 15, the vernier layer 228 can beformed to the same height from the substrate 112 as a metal wiring layer(not shown) constituting the switching element 202.

The droplet material spotting precision test substrate 1004 for thelight emission substrate can be produced by the same process as that forproducing the spotting precision test region 210 in the light emissionsubstrate 1003 of the fifth embodiment. In this embodiment, the spottingprecision test of the droplet material can be carried out by the samestep as the step shown in FIG. 18(A) in the fifth embodiment. In thiscase, the spotting precision test of the droplet material is performedfor the droplet material spotting precision test substrate 1004 beforethe light emission substrate is actually produced.

Since the droplet material spotting precision test substrate 1004 hasthe same structure as the light emission substrate actually produced,the spotting precision test can be carried out in the same manner as thetest for the light emission substrate actually produced. Furthermore, inthis embodiment, the spotting precision test is performed for thedroplet material spotting precision test substrate 1004 exclusively usedas a test substrate before the light emission substrate is produced. Asa result of the test, a convex layer (not shown in FIG. 21) is formed onthe spotting precision test layer 226 like in the light emissionsubstrate 1003 shown in FIG. 15.

Since the droplet material spotting precision test substrate 1004includes the bank shielding layer 222 and the electrode layer 227, whichare respectively formed in the same patterns as the light emissionsubstrate actually produced, the spotting precision of the dropletmaterial is sufficiently confirmed by a pre-test for the dropletmaterial spotting precision test substrate 1004, and then the functionlayer can be formed in the light emission substrate actually producedafter the spotting precision is improved. Thus, the light emissionsubstrate having neither pixel defect nor irregularity in color tone,and high contrast can be produced.

1. A color filter, comprising: a pixel region having a light shieldingregion and a transmitting region surrounded by the light shieldingregion; a color element formed in the transmitting region by discharginga droplet material; a peripheral region arranged adjacent to the pixelregion and having a light shielding region; an evaluation regionincluded in the peripheral region and surrounded by the light shieldingregion of the peripheral region to have a shape corresponding to theshape of the transmitting region; and a layer provided in the peripheralregion to cover the evaluation region and having the property ofrepelling the droplet material.